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PA0185

PA0185

PA0185

Chip Quik Inc.

TO-263-5 DDPAK/D2PAK TO DIP-10

SOT-23

PA0185 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Package Accepted TO-263 (DDPAK/D2PAK)
Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 0.500 17.78mmx12.70mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 5
Pitch 0.067 1.70mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS StatusROHS3 Compliant
In-Stock:1297 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.790000$4.79
10$4.518868$45.18868
100$4.263083$426.3083
500$4.021776$2010.888
1000$3.794129$3794.129

About PA0185

The PA0185 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features TO-263-5 DDPAK/D2PAK TO DIP-10.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PA0185, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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