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PA0170

PA0170

PA0170

Chip Quik Inc.

MINI SOIC-8 EXP PAD TO DIP-8 SMT

SOT-23

PA0170 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Material FR4 Epoxy Glass
Package Accepted MiniSOIC EP
Published 2009
Series Proto-Advantage
Size / Dimension 0.700 x 0.400 17.78mmx10.16mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 8
Pitch 0.026 0.65mm
Proto Board Type SMD to DIP
Board Thickness 0.062 1.57mm 1/16
RoHS StatusROHS3 Compliant
In-Stock:1820 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.69000$3.69

About PA0170

The PA0170 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features MINI SOIC-8 EXP PAD TO DIP-8 SMT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PA0170, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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