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DIP300T600P22

DIP300T600P22

DIP300T600P22

Chip Quik Inc.

DIP-22 (0.3" BODY) TO DIP-22 (0.

SOT-23

DIP300T600P22 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 1.100Lx0.700W 27.94mmx17.78mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 22
Pitch 0.100 2.54mm
Proto Board Type DIP to DIP
Board Thickness 0.063 1.60mm
RoHS StatusROHS3 Compliant
In-Stock:1592 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.59000$4.59

About DIP300T600P22

The DIP300T600P22 from Chip Quik Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIP-22 (0.3" BODY) TO DIP-22 (0..

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DIP300T600P22, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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