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CUD3-02 TR13 PBFREE

CUD3-02 TR13 PBFREE

CUD3-02 TR13 PBFREE

Central Semiconductor Corp

DIODE GEN PURP 200V 4A DPAK

SOT-23

CUD3-02 TR13 PBFREE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 50 Weeks
Mounting Type Surface Mount
Package / Case TO-252-3, DPak (2 Leads + Tab), SC-63
Surface MountYES
PackagingCut Tape (CT)
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Subcategory Rectifier Diodes
Operating Temperature (Max) 150°C
Number of Elements 1
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 20μA @ 200V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 12A
Operating Temperature - Junction -65°C~150°C
Output Current-Max 4A
Voltage - DC Reverse (Vr) (Max) 200V
Current - Average Rectified (Io) 4A
Reverse Recovery Time 35ns
Rep Pk Reverse Voltage-Max 200V
Non-rep Pk Forward Current-Max 70A
RoHS StatusROHS3 Compliant
In-Stock:5617 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.09000$1.09
500$1.0791$539.55
1000$1.0682$1068.2
1500$1.0573$1585.95
2000$1.0464$2092.8
2500$1.0355$2588.75

About CUD3-02 TR13 PBFREE

The CUD3-02 TR13 PBFREE from Central Semiconductor Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE GEN PURP 200V 4A DPAK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CUD3-02 TR13 PBFREE, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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