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ACNT-H87B-500E

ACNT-H87B-500E

ACNT-H87B-500E

Broadcom Limited

1.5pA Instrumentational OP Amps 3V~5.5V 8-SOIC (0.535, 13.60mm Width)

SOT-23

ACNT-H87B-500E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 22 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.535, 13.60mm Width)
Operating Temperature-40°C~110°C TA
PackagingTape & Reel (TR)
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1
Terminal Finish Tin (Sn)
Output Type Differential
Number of Circuits 1
Analog IC - Other Type ANALOG CIRCUIT
Current - Supply 10.5mA
Amplifier Type Isolation
Current - Input Bias 1.5pA
Voltage - Supply, Single/Dual (±) 3V~5.5V
Voltage - Input Offset 300μV
Current - Output / Channel 30mA
-3db Bandwidth 100kHz
RoHS StatusROHS3 Compliant
In-Stock:981 items

Pricing & Ordering

QuantityUnit PriceExt. Price

ACNT-H87B-500E Product Details

ACNT-H87B-500E Overview


Packaged in a 8-SOIC (0.535, 13.60mm Width) case, the buffer op amp is ready to use. Op amps are Isolation types of amplifier on the chip. As far as the packaging is concerned, buffer op amp is delivered in a Tape & Reel (TR) case. For this electrical component, the recommended mounting type is Surface Mount, which is the most common. In terms of operating temperature, this instrumentation amplifier performs well at a temperature of about -40°C~110°C TA . In total, there are 1 circuits on this buffer amplifier. One of the advantages of this op amp is that it outputs Differential signals, which is one of its many advantages. For optimal performance, this electrical part should be connected to a supply with a current of 10.5mA. An analog IC known as a ANALOG CIRCUIT is the other type of IC that is used in this op amp ic.

ACNT-H87B-500E Features


Output Type: Differential

ACNT-H87B-500E Applications


There are a lot of Broadcom Limited ACNT-H87B-500E Instrumentational OP Amps applications.

  • High input resistance broadband
  • Signal transformation
  • Micro signal measurement
  • Wireless base stations
  • High-frequency data acquisition systems
  • Automotive sensors
  • Image computer boards
  • Communication device
  • Commercial audio systems
  • Integrator circuits

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