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SF-1206SP050-2

SF-1206SP050-2

SF-1206SP050-2

Bourns Inc.

SF-1206SP050-2 datasheet pdf and Fuses product details from Bourns Inc. stock available on our website

SOT-23

SF-1206SP050-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Operating Temperature-20°C~105°C
PackagingTape & Reel (TR)
Series SinglFuse™ SF-1206SP
Size / Dimension 0.122Lx0.061W x 0.024 H 3.10mmx1.55mmx0.60mm
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Voltage - Rated DC 63V
Current Rating (Amps) 500mA
Base Part Number SF-1206
Voltage - Rated AC 63V
Approval Agency UL
Response TimeSlow Blow
Fuse Type Board Mount (Cartridge Style Excluded)
Breaking Capacity @ Rated Voltage 50A
Melting I2t 0.027
RoHS StatusROHS3 Compliant
In-Stock:10228 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.472608$0.472608
10$0.445856$4.45856
100$0.420619$42.0619
500$0.396811$198.4055
1000$0.374350$374.35

About SF-1206SP050-2

The SF-1206SP050-2 from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features SF-1206SP050-2 datasheet pdf and Fuses product details from Bourns Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SF-1206SP050-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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