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PM3316-3R3M

PM3316-3R3M

PM3316-3R3M

Bourns Inc.

FIXED IND 3.3UH 5.4A 15 MOHM SMD

SOT-23

PM3316-3R3M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Nonstandard
Terminal Shape WRAPAROUND
Number of Pins 2
Weight 2.700009g
Material - Core Ferrite
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-55°C~105°C
PackagingTape & Reel (TR)
Published 2005
Series PM3316
Size / Dimension 0.500Lx0.394W 12.70mmx10.00mm
Tolerance ±20%
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Packing Method TR
Shielding NO
Number of Functions 1
Construction Bobbin Core
Reach Compliance Code unknown
Current Rating5.4A
Inductance 3.3μH
Test Frequency100kHz
DC Resistance (DCR) 15mOhm
Max DC Current 5A
Inductor Application POWER INDUCTOR
Terminal Placement DUAL ENDED
Current - Saturation 6.4A
Case/Size Code 5137
Self Resonant Frequency54MHz
Height 5mm
Height Seated (Max) 0.209 5.30mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:1042 items

About PM3316-3R3M

The PM3316-3R3M from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 3.3UH 5.4A 15 MOHM SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PM3316-3R3M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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