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PM3308-220M

PM3308-220M

PM3308-220M

Bourns Inc.

FIXED IND 22UH 1.3A 230 MOHM SMD

SOT-23

PM3308-220M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Nonstandard
Terminal Shape WRAPAROUND
Number of Pins 2
Material - Core Ferrite
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2002
Series PM3308
Size / Dimension 0.512Lx0.374W 13.00mmx9.50mm
Tolerance ±20%
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Packing Method TR
Shielding NO
Number of Functions 1
Depth 9.5mm
Construction Bobbin Core
Current Rating1.3A
Military Standard Not
Inductance 22μH
Test Frequency100kHz
DC Resistance (DCR) 230mOhm Max
Max DC Current 1.3A
Inductor Application POWER INDUCTOR
Terminal Placement DUAL ENDED
Current - Saturation 1.6A
Case/Size Code 5137
DC Current 1.3A
Height 3mm
Height Seated (Max) 0.118 3.00mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:2071 items

About PM3308-220M

The PM3308-220M from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 22UH 1.3A 230 MOHM SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PM3308-220M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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