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LPA1226-251KL

LPA1226-251KL

LPA1226-251KL

Bourns Inc.

FIXED IND 250UH 1.2A 300 MOHM TH

SOT-23

LPA1226-251KL Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Material - Core Ferrite
Shape/Size Description TUBULAR PACKAGE
Operating Temperature-40°C~85°C
PackagingBulk
Published 2006
Series LPA
Size / Dimension 0.472Diax0.984L 12.00mmx25.00mm
Tolerance ±10%
JESD-609 Code e2
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Type Wirewound
Terminal Finish Tin/Copper (Sn/Cu)
HTS Code8504.50.80.00
Shielding NO
Number of Functions 1
Construction Shrink Tube
Current Rating1.2A
Base Part Number LPA1226
Military Standard Not
Lead Length 25mm
Lead Diameter 0.8 mm
Inductance 250μH
Test Frequency1kHz
DC Resistance (DCR) 300mOhm Max
Max DC Current 1.2A
Inductor Application POWER INDUCTOR
DC Current 1.2A
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:11267 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$0.76300$76.3

About LPA1226-251KL

The LPA1226-251KL from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 250UH 1.2A 300 MOHM TH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LPA1226-251KL, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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