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LPA0618-500KL

LPA0618-500KL

LPA0618-500KL

Bourns Inc.

FIXED IND 50UH 800MA 200 MOHM TH

SOT-23

LPA0618-500KL Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mounting Type Through Hole
Package / Case Axial
Surface MountNO
Material - Core Ferrite
Shape/Size Description TUBULAR PACKAGE
Operating Temperature-40°C~85°C
PackagingBulk
Published 2006
Series LPA
Size / Dimension 0.236Diax0.984L 6.00mmx25.00mm
Tolerance ±10%
JESD-609 Code e2
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Type Wirewound
Terminal Finish Tin/Copper (Sn/Cu)
HTS Code8504.50.80.00
Shielding NO
Number of Functions 1
Construction Shrink Tube
Base Part Number LPA0618
Military Standard Not
Lead Length 25mm
Inductance 50μH
Test Frequency1kHz
DC Resistance (DCR) 200mOhm Max
Max DC Current 800mA
Inductor Application POWER INDUCTOR
DC Current 800mA
Diameter 6mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:26585 items

Pricing & Ordering

QuantityUnit PriceExt. Price
400$0.31850$127.4

About LPA0618-500KL

The LPA0618-500KL from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 50UH 800MA 200 MOHM TH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LPA0618-500KL, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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