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CR2512-JW-560ELF

CR2512-JW-560ELF

CR2512-JW-560ELF

Bourns Inc.

Res Thick Film 2512 56 Ohm 5% 1W 200ppm/C Molded SMD SMD Embossed Plastic T/R

SOT-23

CR2512-JW-560ELF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 2512 (6432 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2006
Series CR2512
Size / Dimension 0.248Lx0.122W 6.30mmx3.10mm
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Temperature Coefficient±200ppm/°C
Resistance 56Ohm
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Composition Thick Film
Power Rating 1W
Packing Method TR, EMBOSSED PLASTIC, 7 INCH
Max Power Dissipation1W
Depth 3.1mm
Construction Rectangular
Resistor Type FIXED RESISTOR
Military Standard Not
Rated Power Dissipation (P) 1W
Height 762μm
Height Seated (Max) 0.030 0.75mm
RoHS StatusROHS3 Compliant
In-Stock:19044 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About CR2512-JW-560ELF

The CR2512-JW-560ELF from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thick Film 2512 56 Ohm 5% 1W 200ppm/C Molded SMD SMD Embossed Plastic T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CR2512-JW-560ELF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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