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CR2010-JW-132ELF

CR2010-JW-132ELF

CR2010-JW-132ELF

Bourns Inc.

Res Thick Film 2010 1.3K Ohm 5% 1/2W 200ppm/C Molded SMD SMD Embossed Plastic T/R

SOT-23

CR2010-JW-132ELF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 2010 (5025 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2006
Series CR2010
Size / Dimension 0.197Lx0.098W 5.00mmx2.50mm
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±200ppm/°C
Resistance 1.3kOhm
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Composition Thick Film
Power (Watts) 0.5W 1/2W
Packing Method TR, EMBOSSED PLASTIC, 7 INCH
Max Power Dissipation500mW
Construction Rectangular
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.5W
Height 711.2μm
Height Seated (Max) 0.028 0.70mm
RoHS StatusROHS3 Compliant
In-Stock:183759 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About CR2010-JW-132ELF

The CR2010-JW-132ELF from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thick Film 2010 1.3K Ohm 5% 1/2W 200ppm/C Molded SMD SMD Embossed Plastic T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CR2010-JW-132ELF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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