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79F560K

79F560K

79F560K

Bourns Inc.

79F560K datasheet pdf and Fixed Inductors product details from Bourns Inc. stock available on our website

SOT-23

79F560K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Material - Core Ferrite
Shape/Size Description TUBULAR PACKAGE
Operating Temperature-55°C~105°C
PackagingBulk
Series 79F
Published 2004
Size / Dimension 0.100Diax0.160L 2.54mmx4.06mm
Tolerance ±10%
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Type Wirewound
Terminal Finish Tin (Sn)
HTS Code8504.50.80.00
Shielding NO
Number of Functions 1
Current Rating68mA
Lead Length 25.4mm
Inductance 56μH
Test Frequency2.5MHz
DC Resistance (DCR) 6.4Ohm Max
Frequency - Self Resonant 11MHz
Inductor Application RF INDUCTOR
Q @ Freq 40 @ 2.5MHz
Quality Factor-Min (at L-nom) 40
Inductance Frequency - Test 2.5MHz
Rated Current-Max 0.068A
Diameter 2.54mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:2092 items

About 79F560K

The 79F560K from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 79F560K datasheet pdf and Fixed Inductors product details from Bourns Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 79F560K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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