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70F275AI-RC

70F275AI-RC

70F275AI-RC

Bourns Inc.

FIXED IND 27UH 213MA 2.64 OHM TH

SOT-23

70F275AI-RC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Number of Pins 2
Material - Core Iron
Operating Temperature-55°C~105°C
PackagingBulk
Published 2016
Series 70F
Size / Dimension 0.170Diax0.250L 4.32mmx6.35mm
Tolerance ±5%
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Wirewound
Resistance 2.64Ohm
HTS Code8504.50.80.00
Shielding Unshielded
Current Rating213mA
Military Standard Not
Lead Diameter 635 μm
Inductance 27μH
Test Frequency2.5MHz
DC Resistance (DCR) 2.64Ohm Max
Max DC Current 213mA
Frequency - Self Resonant 12MHz
Q @ Freq 49 @ 2.5MHz
Q Factor 49
DC Current 213mA
Diameter 4.318mm
RoHS StatusROHS3 Compliant
In-Stock:3235 items

About 70F275AI-RC

The 70F275AI-RC from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 27UH 213MA 2.64 OHM TH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 70F275AI-RC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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