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70ADJ-4-ML1G

70ADJ-4-ML1G

70ADJ-4-ML1G

Bourns Inc.

Battery Contacts 4 Position Male SMD

SOT-23

70ADJ-4-ML1G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Material Copper Alloy
Housing Material Thermoplastic
PackagingTape & Reel (TR)
Published 2012
Series 70AD
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Compression Contact, Male
Max Operating Temperature125°C
Min Operating Temperature -55°C
Color Black
Number of Rows 1
Gender Male
Voltage - Rated DC 30V
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 0.157 4.00mm
Orientation Straight
Depth 11mm
Base Part Number 70ADJ
Contact Finish Gold
Number of Contacts 4
Max Voltage Rating (DC) 30V
Length 15.7mm
Contact Finish Thickness 30.0μin 0.76μm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:3893 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.830192$0.830192
10$0.783200$7.832
100$0.738868$73.8868
500$0.697045$348.5225
1000$0.657590$657.59

About 70ADJ-4-ML1G

The 70ADJ-4-ML1G from Bourns Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Battery Contacts 4 Position Male SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 70ADJ-4-ML1G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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