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RCP 310 F

RCP 310 F

RCP 310 F

Bopla Enclosures

HOUSING ABS 10.28"L X 11.65"W

SOT-23

RCP 310 F Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Material Plastic, ABS
Weight 2.6lbs 1.2kg
PackagingBulk
Series RCP, RCPM
Size / Dimension 10.276Lx11.654W 261.00mmx296.00mm
Feature Card Guides, PCB Supports
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Color Gray
Design Cover Included
Container Type Housing
Area (L x W) 120in2 (774cm2)
Height 4.409 112.00mm
Thickness 0.118 3.00mm
Material Flammability Rating UL94 HB
RoHS StatusROHS3 Compliant
Ratings IP54
In-Stock:111 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$76.61000$76.61

About RCP 310 F

The RCP 310 F from Bopla Enclosures is a high-performance microcontroller designed for a wide range of embedded applications. This component features HOUSING ABS 10.28"L X 11.65"W.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RCP 310 F, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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