Welcome to Hotenda.com Online Store!

logo
userjoin
Home

GPTGP7000ULM-0.060-02-0808

GPTGP7000ULM-0.060-02-0808

GPTGP7000ULM-0.060-02-0808

Bergquist

GAP PAD 8X8" SHEET 0.060"

SOT-23

GPTGP7000ULM-0.060-02-0808 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Material Silicone
Shape Square
Series Gap Pad® 7000ULM
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Shelf Life 6 Months
Adhesive Tacky - Both Sides
Storage/Refrigeration Temperature 77°F 25°C
Shelf Life Start Date of Manufacture
Outline 203.20mm x 203.20mm
Thermal Conductivity7.0W/m-K
Thickness 0.0600 1.524mm
RoHS StatusROHS3 Compliant
In-Stock:89 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$138.40000$138.4
500$137.016$68508
1000$135.632$135632
1500$134.248$201372
2000$132.864$265728
2500$131.48$328700

About GPTGP7000ULM-0.060-02-0808

The GPTGP7000ULM-0.060-02-0808 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features GAP PAD 8X8" SHEET 0.060".

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the GPTGP7000ULM-0.060-02-0808, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News