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GPHC3.0-0.060-02-0816

GPHC3.0-0.060-02-0816

GPHC3.0-0.060-02-0816

Bergquist

THERM PAD 406.4MMX203.2MM BLUE

SOT-23

GPHC3.0-0.060-02-0816 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Shape Rectangular
Series Gap Pad® HC 3.0
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Blue
Adhesive Tacky - Both Sides
Backing, Carrier Fiberglass
Outline 406.40mm x 203.20mm
Thermal Conductivity3.0W/m-K
Thickness 0.0600 1.524mm
RoHS StatusROHS3 Compliant
In-Stock:105 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$68.859402$68.859402
10$64.961699$649.61699
100$61.284622$6128.4622
500$57.815681$28907.8405
1000$54.543095$54543.095

About GPHC3.0-0.060-02-0816

The GPHC3.0-0.060-02-0816 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 406.4MMX203.2MM BLUE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the GPHC3.0-0.060-02-0816, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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