GF4000-00-240-50CC Description
BERGQUIST GAP FILLER TGF 4000 is a two-part, high thermal conductivity, liquid gap-filling material. The mixed system will cure at room temperature and can be accelerated with the addition of heat. BERGQUIST GAP FILLER TGF 4000 offers an extended working time to allow greater flexibility in the customer’s assembly process. Liquid-dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 4000 exhibits low-level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.
GF4000-00-240-50CC Features
Thermal Conductivity: 4.0 W/m-K
Extended working time for manufacturing flexibility
Ultra-conforming, with excellent wet-out
100% solids - no cure by-products
Excellent low and high-temperature mechanical and chemical stability
GF4000-00-240-50CC Applications
Automotive electronics (HEV, NEV, batteries)
Computer and peripherals
Between any heat-generating semiconductor and a heat sink
Telecommunications
