GENERAL ATOMICS UHK17128 REVX2 Description
A practical, thermally conductive interface material is GAP PAD VO. The product is a filled, thermally conductive polymer that is delivered on a fiberglass carrier with a rubber coating for simple material handling. GAP PAD VO can fill up air gaps between PC boards and heat sinks or a metal chassis because of its conformable nature.
GENERAL ATOMICS UHK17128 REVX2 Features
Thermal conductivity: 0.8 W/m-K
Enhanced puncture, shear and tear resistance
Conformable gap filling material
Electrically isolating
GENERAL ATOMICS UHK17128 REVX2 Applications
Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Between heat-generating magnetic components and a heat sink
