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CPU 1.75X1.75

CPU 1.75X1.75

CPU 1.75X1.75

Bergquist

CPU 1.75X1.75 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website

SOT-23

CPU 1.75X1.75 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Shape Square
Series CPU Pad™
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Pad, Sheet
Color Tan
Usage CPU
Outline 44.45mm x 44.45mm
Thermal Conductivity0.6W/m-K
Thickness 0.0050 0.127mm
In-Stock:3338 items

About CPU 1.75X1.75

The CPU 1.75X1.75 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features CPU 1.75X1.75 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CPU 1.75X1.75, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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