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BP100-0.005-00-1112

BP100-0.005-00-1112

BP100-0.005-00-1112

Bergquist

BP100-0.005-00-1112 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website

SOT-23

BP100-0.005-00-1112 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Adhesive
Package / Case 100
Material Polyimide
Shape Rectangular
Series Bond-Ply® 100
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Sheet, Tape
Max Operating Temperature120°C
Min Operating Temperature -30°C
Color White
Adhesive Adhesive - Both Sides
Backing, Carrier Fiberglass
Outline 304.80mm x 279.40mm
Thermal Conductivity0.8W/m-K
Natural Thermal Resistance 0.52 °C/W
Thermal Resistivity0.52°C/W
Length 279.4mm
Width 304.8mm
Thickness 0.0050 0.127mm
RoHS StatusROHS3 Compliant
In-Stock:522 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$23.104000$23.104
10$21.796226$217.96226
100$20.562478$2056.2478
500$19.398564$9699.282
1000$18.300532$18300.532

About BP100-0.005-00-1112

The BP100-0.005-00-1112 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features BP100-0.005-00-1112 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BP100-0.005-00-1112, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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