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1009AC-60

1009AC-60

1009AC-60

Bergquist

THERMAL PAD TO-126 .009 SP1000

SOT-23

1009AC-60 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Package / Case TO-126
Material Silicone Rubber
Shape Rectangular
Published 2000
Series Sil-Pad® 1000
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Pad, Sheet
Color Pink
Usage TO-126
Shelf Life 6 Months
Adhesive Adhesive - One Side
Storage/Refrigeration Temperature 90°F 32.22°C or Below
Backing, Carrier Fiberglass
Outline 11.10mm x 7.92mm
Thermal Conductivity1.2W/m-K
Natural Thermal Resistance 0.35 °C/W
Thermal Resistivity0.35°C/W
Length 11.1mm
Width 7.92mm
Thickness 0.0090 0.229mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:21269 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 1009AC-60

The 1009AC-60 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERMAL PAD TO-126 .009 SP1000.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1009AC-60, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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