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8729 009U500

8729 009U500

8729 009U500

Belden Inc.

8729 009U500 datasheet pdf and Multiple Conductor Cables product details from Belden Inc. stock available on our website

SOT-23

8729 009U500 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Conductor MaterialCopper, Tinned
Jacket (Insulation) Material Poly-Vinyl Chloride (PVC)
Shield Material Aluminum
Operating Temperature-40°C~75°C
PackagingSpool
Published 2012
Feature Drain Wire
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Reach Compliance Code compliant
Number of Conductors 4
Wire Gauge22 AWG
Voltage 300V
Connector Support Type WIRE AND CABLE
Cable TypeMulti-Conductor
Jacket Color White
Conductor Strand19/34
Usage Audio, Control, Instrumentation
Jacket (Insulation) Diameter 0.257 (6.53mm)
Conductor Insulation Polyethylene (PE)
Shield Type Foil
Shield Coverage 100%
Length 500.0' 152.4m
Jacket (Insulation) Thickness 0.0510 1.295mm
RoHS StatusRoHS Compliant
Ratings UL Style 2094
In-Stock:38 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 8729 009U500

The 8729 009U500 from Belden Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 8729 009U500 datasheet pdf and Multiple Conductor Cables product details from Belden Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8729 009U500, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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