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100-1221-3

100-1221-3

100-1221-3

BECOM Systems GmbH

100-1221-3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from BECOM Systems GmbH stock available on our website

SOT-23

100-1221-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~70°C
Series Blackfin®
Size / Dimension 1.44 x 1.24 36.5mmx31.5mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Expansion 2 x 60
Speed 600MHz
RAM Size 32MB
Core Processor CM-BF537
Module/Board Type MPU Core
Flash Size 4MB
RoHS StatusRoHS Compliant
In-Stock:63 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$333.868981$333.868981
10$314.970737$3149.70737
100$297.142205$29714.2205
500$280.322834$140161.417
1000$264.455504$264455.504

100-1221-3 Product Details

100-1221-3 Overview


A MPU Core module or board is used in the microcontroller.It has CM-BF537 cores and is driven by a processor.It is default for the microcontroller to set the mode to 0°C~70°C.Flash size on this MCU electronics is 4MB.In this case, the connector type is Expansion 2 x 60.I would say that MCU chip belongs to the Blackfin? Series.The RAM size has been reduced to 32MB in order to ensure that the software runs normally.In this case, the MCU chip operates at a 600MHz speed.

100-1221-3 Features


Core processor of CM-BF537
Flash size of 4MB
Speed of 600MHz

100-1221-3 Applications


There are a lot of BECOM Systems GmbH 100-1221-3 Microcontroller, Microprocessor, FPGA Modules applications.

  • Thermostat
  • Closed Loop Motor Control
  • IoT Secure Gateways
  • Embedded Control Processing
  • Network Enabled Data Acquisition
  • Test and Measurement
  • Software Defined Radio
  • Patient Monitoring
  • Weighing Scales
  • Industrial Instrumentation

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