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CDR3UT1BP271BJSP

CDR3UT1BP271BJSP

CDR3UT1BP271BJSP

AVXCORPORATION

CDR3UT1BP271BJSP datasheet pdf and Evaluation, Development Board Enclosures product details from AVXCORPORATION stock available on our website

SOT-23

CDR3UT1BP271BJSP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time -
Lifecycle Status 13 Weeks
Mount Press Fit, Through Hole
Mounting Type Press Fit, Through Hole
Package / Case TQFP
Number of Pins 7
Operating Temperature -55°C ~ 150°C
Packaging -
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 6
ECCN Code -
Temperature Coefficient -
Subcategory Other Sensors/Transducers
Voltage - Supply 10V ~ 40V
Base Part Number Rqwju Gmvfi
Output Voltage 65 V
Output Type N-Channel
Interface Analog
Termination Type -
Operating Supply Current 1 μA
Nominal Supply Current 10 mA
Output Current 90 mA
Max Supply Current 10 mA
Slew Rate 0.3V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:3066 items

About CDR3UT1BP271BJSP

The CDR3UT1BP271BJSP from AVXCORPORATION is a high-performance microcontroller designed for a wide range of embedded applications. This component features CDR3UT1BP271BJSP datasheet pdf and Evaluation, Development Board Enclosures product details from AVXCORPORATION stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CDR3UT1BP271BJSP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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