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TPSD226K025P0200

TPSD226K025P0200

TPSD226K025P0200

AVX Corporation

CAP TANT 22UF 10% 25V 2917

SOT-23

TPSD226K025P0200 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 21 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2917 (7343 Metric)
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2007
Series TPS
Size / Dimension 0.287Lx0.169W 7.30mmx4.30mm
Tolerance ±10%
JESD-609 Code e3
Feature General Purpose
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Molded
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
HTS Code8532.21.00.50
Capacitance 22μF
Voltage - Rated DC 25V
Packing Method TR, 13 INCH
Depth 4.3mm
Case Code (Metric) 7343
Case Code (Imperial) 2917
ESR (Equivalent Series Resistance) 200mOhm
Leakage Current 0.0055mA
Ripple Current779mA
Tan Delta 0.06
Manufacturer Size Code D
Height 3.1mm
Height Seated (Max) 0.122 3.10mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2603 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About TPSD226K025P0200

The TPSD226K025P0200 from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP TANT 22UF 10% 25V 2917.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TPSD226K025P0200, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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