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SV01GC331KAR

SV01GC331KAR

SV01GC331KAR

AVX Corporation

CAP CER 330PF 2KV X7R RADIAL

SOT-23

SV01GC331KAR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 30 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Number of Pins 2
Dielectric MaterialCERAMIC
Operating Temperature-55°C~125°C
PackagingBulk
Published 2010
Series SV
Size / Dimension 0.250Lx0.200W 6.35mmx5.08mm
Tolerance ±10%
JESD-609 Code e3
Feature High Voltage
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientX7R
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Capacitance 330pF
Voltage - Rated DC 2kV
Lead Pitch 4.318mm
Capacitor Type CERAMIC CAPACITOR
Lead Length 31.8mm
Lead Spacing0.170 4.32mm
Temperature Characteristics Code X7R
Multilayer Yes
Lead Diameter 640 μm
Lead Style Straight
Dissipation Factor2.5 %
Height 5.59mm
Height Seated (Max) 0.220 5.59mm
Width 5.08mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:798 items

Pricing & Ordering

QuantityUnit PriceExt. Price
300$5.94500$1783.5

About SV01GC331KAR

The SV01GC331KAR from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 330PF 2KV X7R RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SV01GC331KAR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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