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SR217A220JAR

SR217A220JAR

SR217A220JAR

AVX Corporation

CAP CER 22PF 500V NP0 RADIAL

SOT-23

SR217A220JAR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Operating Temperature-55°C~125°C
PackagingBulk
Published 2013
Series SkyCap® SR
Size / Dimension 0.200Lx0.125W 5.08mmx3.18mm
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientC0G NP0
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Applications General Purpose
Capacitance 22pF
Voltage - Rated DC 50V
Lead Pitch 5.08mm
Capacitor Type CERAMIC CAPACITOR
Dielectric C0G
Lead Spacing0.200 5.08mm
Temperature Characteristics Code C0G
Rated (DC) Voltage (URdc) 500V
Lead Diameter 508 μm
Size Code 2012
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
Height 5.08mm
Height Seated (Max) 0.300 7.62mm
Width 3.175mm
Thickness 3.17mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:18852 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About SR217A220JAR

The SR217A220JAR from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 22PF 500V NP0 RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SR217A220JAR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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