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NOSW686M002R0150

NOSW686M002R0150

NOSW686M002R0150

AVX Corporation

CAP NIOB OXID 68UF 20% 2.5V 2312

SOT-23

NOSW686M002R0150 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 21 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2312 (6032 Metric)
Terminal Shape J BEND
Number of Pins 2
Dielectric MaterialNiobium Oxide
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2008
Series OxiCap® NOS
Size / Dimension 0.236Lx0.126W 6.00mmx3.20mm
Tolerance ±20%
JESD-609 Code e3
Feature Low ESR
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Termination SMD/SMT
ECCN Code EAR99
Resistance 150mOhm
Capacitance 68μF
Voltage - Rated DC 2.5V
Packing Method TR, 7 INCH
Case Code (Metric) 6032
Case Code (Imperial) 2312
Capacitor Type SPECIAL CAPACITOR
ESR (Equivalent Series Resistance) 150mOhm
Ripple Current849mA
Dissipation Factor6%
Manufacturer Size Code W
Current - Leakage 3.4μA
Height 1.5mm
Height Seated (Max) 0.059 1.50mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:7376 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About NOSW686M002R0150

The NOSW686M002R0150 from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP NIOB OXID 68UF 20% 2.5V 2312.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the NOSW686M002R0150, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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