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06035J0R3BBSTR

06035J0R3BBSTR

06035J0R3BBSTR

AVX Corporation

ACCU-F/P

SOT-23

06035J0R3BBSTR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Package / Case 0603
Surface MountYES
Terminal Shape WRAPAROUND
Mounting FeatureSURFACE MOUNT
Dielectric MaterialSILICON DIOXIDE AND NITRIDE
PackagingTape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Temperature Coefficient0 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Max Operating Temperature125°C
Min Operating Temperature -55°C
Composition Thin Film
Additional FeatureCAPACITANCE TOLERANCE IS 0.1 PICO FARAD
HTS Code8532.25.00.45
Capacitance 300FF
Voltage - Rated DC 50V
Packing Method TR, 7/13 INCH
Capacitor Type FILM CAPACITOR
Positive Tolerance 33.3333%
Negative Tolerance 33.3333%
Height 630μm
Length 1.6mm
Width 800μm
RoHS StatusROHS3 Compliant
In-Stock:22903 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.32000$0.32
500$0.3168$158.4
1000$0.3136$313.6
1500$0.3104$465.6
2000$0.3072$614.4
2500$0.304$760

About 06035J0R3BBSTR

The 06035J0R3BBSTR from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features ACCU-F/P.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 06035J0R3BBSTR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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