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0201YJ3R0CBWTR

0201YJ3R0CBWTR

0201YJ3R0CBWTR

AVX Corporation

CAP THIN FILM 3PF 16V 0201

SOT-23

0201YJ3R0CBWTR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0201 (0603 Metric)
Terminal Shape WRAPAROUND
Dielectric MaterialSILICON DIOXIDE AND NITRIDE
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2007
Series Accu-P®
Size / Dimension 0.024Lx0.013W 0.60mmx0.33mm
Tolerance ±0.25pF
JESD-609 Code e0
Feature RF, High Q, Low Loss
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal Finish Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Additional FeatureCAPACITANCE TOLERANCE IS 0.25 PICO FARAD
HTS Code8532.25.00.45
Capacitance 3pF
Voltage - Rated DC 16V
Packing Method TR, 7/13 INCH
Reach Compliance Code not_compliant
Reference Standard MIL-STD-202F
Capacitor Type FILM CAPACITOR
Height 225μm
Height Seated (Max) 0.011 0.28mm
Length 0.6mm
Width 0.325mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:4738 items

About 0201YJ3R0CBWTR

The 0201YJ3R0CBWTR from AVX Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP THIN FILM 3PF 16V 0201.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0201YJ3R0CBWTR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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