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H8MMS-3036M

H8MMS-3036M

H8MMS-3036M

Assmann WSW Components

DIP CBL - HHDM30S/AE30M/HHDM30S

SOT-23

H8MMS-3036M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingTin
Published 2006
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type DIP to DIP, Reversed
Number of Positions 30
Color Multiple, Ribbon
Number of Rows 2
Shielding Unshielded
Contact Finish Tin
Number of Contacts 30
Cable TerminationIDC
Usage Socket (0.1), Board In
Pitch - Connector 0.100 2.54mm
Pitch - Cable 0.050 1.27mm
Length 3.00' 914.40mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1009 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.69000$6.69
10$6.42400$64.24
25$5.88880$147.22
50$5.62120$281.06
100$5.35350$535.35
250$4.68428$1171.07
500$4.55046$2275.23

About H8MMS-3036M

The H8MMS-3036M from Assmann WSW Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIP CBL - HHDM30S/AE30M/HHDM30S.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H8MMS-3036M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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