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H8MMS-1606G

H8MMS-1606G

H8MMS-1606G

Assmann WSW Components

DIP CBL - HHDM16S/AE16G/HHDM16S

SOT-23

H8MMS-1606G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Published 2006
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type DIP to DIP, Reversed
Number of Positions 16
Color Gray, Ribbon
Number of Rows 2
Shielding Unshielded
Contact Finish Tin
Cable TerminationIDC
Usage Socket (0.1), Board In
Pitch - Connector 0.100 2.54mm
Pitch - Cable 0.050 1.27mm
Length 0.500' 152.40mm 6.00
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4770 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.43000$1.43
10$1.25800$12.58
25$1.18360$29.59
50$1.13420$56.71
100$1.08500$108.5
250$0.98632$246.58
500$0.88770$443.85

About H8MMS-1606G

The H8MMS-1606G from Assmann WSW Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIP CBL - HHDM16S/AE16G/HHDM16S.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H8MMS-1606G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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