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H6MMS-3018G

H6MMS-3018G

H6MMS-3018G

Assmann WSW Components

DIP CBL - HHDM30S/AE30G/HHDM30S

SOT-23

H6MMS-3018G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Published 2006
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type DIP to DIP
Number of Positions 30
Color Gray, Ribbon
Number of Rows 2
Shielding Unshielded
Contact Finish Tin
Cable TerminationIDC
Usage Socket (0.1), Board In
Pitch - Connector 0.100 2.54mm
Pitch - Cable 0.050 1.27mm
Length 1.50' 457.20mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2481 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.68000$3.68
10$3.52800$35.28
25$3.23440$80.86
50$3.08740$154.37
100$2.94030$294.03
250$2.57276$643.19
500$2.49926$1249.63

About H6MMS-3018G

The H6MMS-3018G from Assmann WSW Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIP CBL - HHDM30S/AE30G/HHDM30S.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H6MMS-3018G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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