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32-655000-10

32-655000-10

32-655000-10

Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP 0.6

SOT-23

32-655000-10 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Mounting Type Through Hole
Number of Pins 32
Contact Material - Mating Copper
Contact Material - Post Brass
Board Material FR4 Epoxy Glass
Published 2006
Series Correct-A-Chip® 655000
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Additional FeatureSOCKET ADAPTER
Contact Finish - Mating Silver
Pitch - Mating 0.020 0.50mm
Number of Contacts 32
Contact Finish - Post Tin-Lead
Device Socket Type IC SOCKET
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Convert From (Adapter End) TSOP
Convert To (Adapter End) DIP, 0.6 (15.24mm) Row Spacing
Height 1.58mm
Length 40.6mm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS StatusNon-RoHS Compliant
Lead Free Lead Free
In-Stock:235 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$32.485000$32.485
10$30.646226$306.46226
100$28.911534$2891.1534
500$27.275032$13637.516
1000$25.731163$25731.163

About 32-655000-10

The 32-655000-10 from Aries Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features SOCKET ADAPTER TSOP TO 32DIP 0.6.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 32-655000-10, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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