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24-350000-11-RC

24-350000-11-RC

24-350000-11-RC

Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

SOT-23

24-350000-11-RC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass
Contact PlatingGold
Mount Through Hole
Material FR4 Epoxy Glass
Package Accepted SOIC
Published 2006
Series Correct-A-Chip® 350000
Size / Dimension 2.400Lx0.450W 60.96mmx11.43mm
JESD-609 Code e4
Feature High Temperature
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 24
Max Operating Temperature200°C
Number of Rows 2
Additional FeatureSOCKET ADAPTER
Pitch 0.050 1.27mm
Orientation Straight
Depth 11.68mm
Number of Contacts 24
Row Spacing7.62 mm
Device Socket Type IC SOCKET
Proto Board Type SMD to DIP
Height 2.09mm
Board Thickness 0.062 1.57mm 1/16
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:804 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$34.475635$34.475635
10$32.524184$325.24184
100$30.683193$3068.3193
500$28.946408$14473.204
1000$27.307932$27307.932

About 24-350000-11-RC

The 24-350000-11-RC from Aries Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features SOCKET ADAPTER SOIC TO 24DIP 0.3.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 24-350000-11-RC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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