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16-350000-10

16-350000-10

16-350000-10

Aries Electronics

16 Position 2.54 mm Spacing Through-Hole SOIC DIP Socket

SOT-23

16-350000-10 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass
Contact PlatingTin
Material FR4 Epoxy Glass
Package Accepted SOIC
Published 2010
Series Correct-A-Chip® 350000
Size / Dimension 1.600Lx0.450W 40.64mmx11.43mm
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 16
Max Operating Temperature105°C
Min Operating Temperature -55°C
Number of Rows 2
Additional FeatureSOCKET ADAPTER
Pitch 0.050 1.27mm
Terminal Pitch2.54mm
Reach Compliance Code not_compliant
Number of Contacts 16
Row Spacing7.62 mm
Device Socket Type IC SOCKET
Proto Board Type SMD to DIP
Height 1.58mm
Board Thickness 0.062 1.57mm 1/16
RoHS StatusNon-RoHS Compliant
Lead Free Lead Free
In-Stock:844 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$10.496076$10.496076
10$9.901958$99.01958
100$9.341470$934.147
500$8.812707$4406.3535
1000$8.313875$8313.875

About 16-350000-10

The 16-350000-10 from Aries Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features 16 Position 2.54 mm Spacing Through-Hole SOIC DIP Socket.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 16-350000-10, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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