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4590R-334K

4590R-334K

4590R-334K

API Delevan Inc.

4590R-334K datasheet pdf and Fixed Inductors product details from API Delevan Inc. stock available on our website

SOT-23

4590R-334K Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Material - Core Ferrite
Shape/Size Description TUBULAR PACKAGE
Operating Temperature-55°C~125°C
PackagingBulk
Series 4590R
Published 2010
Size / Dimension 0.455Diax0.900L 11.55mmx22.86mm
Tolerance ±10%
JESD-609 Code e2
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Type Wirewound
Terminal Finish Tin/Copper (Sn99.3Cu0.7)
HTS Code8504.50.80.00
Shielding NO
Number of Functions 1
Construction Tubular
Current Rating1.61A
Lead Length 27.9mm
Inductance 330μH
Test Frequency
In-Stock:1409 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.22000$5.22
500$5.1678$2583.9
1000$5.1156$5115.6
1500$5.0634$7595.1
2000$5.0112$10022.4
2500$4.959$12397.5

About 4590R-334K

The 4590R-334K from API Delevan Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 4590R-334K datasheet pdf and Fixed Inductors product details from API Delevan Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4590R-334K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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