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HS32

HS32

HS32

Apex Microtechnology

HEATSINK SIP 1.33C/W

SOT-23

HS32 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Clip
Package / Case SIP
Material Aluminum
Shape Rectangular, Fins
Package Cooled SIP
Material Finish Black Anodized
Series Apex Precision Power®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Board Level, Vertical, Extrusion
Attachment Method Clip
Height Off Base (Height of Fin) 1.338 34.00mm
Thermal Resistance @ Natural 1.33°C/W
Length 6.000 152.40mm
Width 2.953 75.00mm
RoHS StatusNon-RoHS Compliant
In-Stock:3916 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$48.409000$48.409
10$45.668868$456.68868
100$43.083838$4308.3838
500$40.645130$20322.565
1000$38.344462$38344.462

About HS32

The HS32 from Apex Microtechnology is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK SIP 1.33C/W.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HS32, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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