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HS13

HS13

HS13

Apex Microtechnology

HEATSINK TO3

SOT-23

HS13 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Bolt
Material Aluminum
Shape Rectangular, Fins
Package Cooled TO-3
Material Finish Black Anodized
Published 2014
Series Apex Precision Power®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Board Level, Extrusion
Attachment Method Bolt On
Height Off Base (Height of Fin) 1.310 33.27mm
Thermal Resistance @ Forced Air Flow 0.40°C/W @ 800 LFM
Thermal Resistance @ Natural 1.48°C/W
Length 5.421 139.70mm
Width 4.812 122.22mm
RoHS StatusNon-RoHS Compliant
In-Stock:2385 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$104.789000$104.789
10$98.857547$988.57547
100$93.261837$9326.1837
500$87.982865$43991.4325
1000$83.002703$83002.703

About HS13

The HS13 from Apex Microtechnology is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK TO3.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HS13, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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