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LTC1657LIN

LTC1657LIN

LTC1657LIN

Analog Devices, Inc.

DAC 7.62mm mm

SOT-23

LTC1657LIN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
PackagingBulk
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Subcategory Other Converters
Technology CMOS
Terminal Position DUAL
Peak Reflow Temperature (Cel) 255
Number of Functions 1
Supply Voltage 3V
Terminal Pitch2.54mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count28
Qualification StatusNot Qualified
Power Supplies3/5V
Temperature GradeINDUSTRIAL
Interface Parallel
Power Dissipation-Max 3.25mW
Number of Bits 16
Converter Type D/A CONVERTER
Supply Type Single
Settling Time20 μs
Input Bit Code BINARY
Number of Converters 1
Analog Output Voltage-Max 2.5V
Height Seated (Max) 3.937mm
Width 7.62mm
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:2193 items

LTC1657LIN Product Details

LTC1657LIN Overview


There is a DIP package that includes this component. It is powered from a supply voltage of 3V. Other Converters family FPGA part. As a space-saving measure, this FPGA model is contained within Bulk. Total terminations are 28. Providing that this FPGA is mounted in Through Hole, it will be able to perform according to its specifications in a flawless manner. Power is provided by a 3/5V battery that is included with the device. This module is capable of operating at a maximum temperature of 85°C. -40°C should be higher than the operating temperature. As far as the pin count is concerned, it has 28 pins.

LTC1657LIN Features


DIP package
28 pin count


LTC1657LIN Applications


There are a lot of Analog Devices, Inc.
LTC1657LIN Digital to Analog Converters (DAC) applications.


  • Display Electronics
  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:

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