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LTC1655IN8

LTC1655IN8

LTC1655IN8

Analog Devices, Inc.

DAC

SOT-23

LTC1655IN8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
PackagingBulk
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface Serial
Number of Bits 16
Supply Type Single
Sampling Rate750 ksps
Settling Time20 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:380 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$77.053360$77.05336
10$72.691849$726.91849
100$68.577216$6857.7216
500$64.695487$32347.7435
1000$61.033478$61033.478

LTC1655IN8 Product Details

LTC1655IN8 Overview


The package that contains this software is called DIP. It is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In my opinion, this FPGA could produce fantastic results if mounted in Through Hole, provided that its specifications are followed. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than -40°C is recommended.

LTC1655IN8 Features


DIP package


LTC1655IN8 Applications


There are a lot of Analog Devices, Inc.
LTC1655IN8 Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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