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LTC1595BIN8

LTC1595BIN8

LTC1595BIN8

Analog Devices, Inc.

DAC

SOT-23

LTC1595BIN8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
PackagingBulk
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface SPI, Serial
Number of Bits 16
Supply Type Single
Settling Time1 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:1804 items

LTC1595BIN8 Product Details

LTC1595BIN8 Overview


This package is included in the DIP package and is available for purchase. Using the Bulk layout, this FPGA model can be contained in a very small amount of space. It is possible for this FPGA to perform as per its specifications as long as it is mounted in Through Hole direction. In this module, 85°C is the maximum operating temperature at which it can operate. Over -40°C, the operating temperature should be higher.

LTC1595BIN8 Features


DIP package


LTC1595BIN8 Applications


There are a lot of Analog Devices, Inc.
LTC1595BIN8 Digital to Analog Converters (DAC) applications.


  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators

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