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LTC1450LCN

LTC1450LCN

LTC1450LCN

Analog Devices, Inc.

DAC

SOT-23

LTC1450LCN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case DIP
PackagingBulk
Max Operating Temperature70°C
Min Operating Temperature 0°C
Interface Parallel
Number of Bits 12
Supply Type Single
Settling Time14 μs
Number of Converters 1
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:1690 items

LTC1450LCN Product Details

LTC1450LCN Overview


There are two packages that contain it: DIP package and X package. There is an FPGA model contained in Bulk in order to conserve space. Having stated that, if this FPGA is mounted in Through Hole, then it may be able to perform fantastically according to its specifications. During its maximal operating temperature, this module reaches 70°C. In order to achieve 0°C, the operating temperature must be higher than 0°C.

LTC1450LCN Features


DIP package


LTC1450LCN Applications


There are a lot of Analog Devices, Inc.
LTC1450LCN Digital to Analog Converters (DAC) applications.


  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation

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