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ADSP-BF537BBCZ-5AV
Hotenda
Copper, Silver, Tin 132kB CPLD Blackfin? Series ADSP-BF537 182 Pin 533MHz 1.25V 182-LFBGA, CSPBGA
SOT-23
ADSP-BF537BBCZ-5AV Datasheet PDF
non-compliant
| Parameter Name | Value |
|---|---|
| Type | Parameter |
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 182-LFBGA, CSPBGA |
| Number of Pins | 182 |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tray |
| Series | Blackfin® |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 182 |
| Termination | SMD/SMT |
| Type | Fixed Point |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Subcategory | Microprocessors |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.25V |
| Frequency | 533MHz |
| [email protected] Reflow Temperature-Max (s) | 40 |
| Base Part Number | ADSP-BF537 |
| Pin Count | 182 |
| Interface | CAN, SPI, SSP, TWI, UART |
| Max Supply Voltage | 1.375V |
| Min Supply Voltage | 800mV |
| Memory Size | 132kB |
| Number of I/O | 48 |
| RAM Size | 32kB |
| Memory Type | ROM |
| Bit Size | 32 |
| Data Bus Width | 16b |
| Number of Timers/Counters | 9 |
| Core Architecture | Blackfin |
| Boundary Scan | YES |
| Low Power Mode | YES |
| Voltage - I/O | 3.30V |
| Number of UART Channels | 2 |
| Number of PWM Channels | 8 |
| Barrel Shifter | YES |
| Internal Bus Architecture | MULTIPLE |
| Non-Volatile Memory | External |
| Voltage - Core | 1.25V |
| Number of Ethernet Channels | 1 |
| Height | 1.31mm |
| Length | 12mm |
| Width | 12mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
| Quantity | Unit Price | Ext. Price |
| 1 | $38.32000 | $38.32 |
| 10 | $35.34500 | $353.45 |
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