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191-3003-050

191-3003-050

191-3003-050

Amphenol Spectra-Strip

Flat Cables 30/32 AWG 30/78 .025 Ribbon Zip 50 Cond

SOT-23

191-3003-050 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Cable
Insulation Material Polyvinyl
Conductor MaterialCopper, Bare
Jacket (Insulation) Material Poly-Vinyl Chloride (PVC)
Operating Temperature-20°C~105°C
PackagingBulk
Published 2010
Series Spectra-Zip®
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) Not Applicable
Color Grey
Voltage - Rated 150V
Capacitance 62.32pF
Voltage - Rated DC 150V
Pitch 0.025 0.64mm
Shielding Unshielded
Depth 31.75mm
Reach Compliance Code unknown
Current Rating800mA
Number of Conductors 50
Wire Gauge30 AWG
Insulation Resistance10GOhm
Max Current Rating 900mA
Cable TypeFlat Cable
Impedance80Ohm
Cable Length30.48m
Wire/Cable Gauge 30 AWG
Jacket Color Gray
Conductor StrandSolid
Cable Pitch 635μm
Ribbon Width 1.250 31.75mm
Number of Strands 1
First Conductor Mark Black
Length 100.0' 30.48m
Width 31.75mm
Ribbon Thickness 0.025 0.64mm
RoHS StatusROHS3 Compliant
Ratings UL Style 2678
In-Stock:3488 items

About 191-3003-050

The 191-3003-050 from Amphenol Spectra-Strip is a high-performance microcontroller designed for a wide range of embedded applications. This component features Flat Cables 30/32 AWG 30/78 .025 Ribbon Zip 50 Cond.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 191-3003-050, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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