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BU-10PMMS-LC7001

BU-10PMMS-LC7001

BU-10PMMS-LC7001

Amphenol LTW

Receptacle, Male Pins Polyamide (PA), Nylon, Glass Filled Panel Mount 10 Positions Solder Cup Gold Tray Keyed Bayonet Lock

SOT-23

BU-10PMMS-LC7001 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Contact MaterialCopper Alloy
Contact PlatingGold
Mount Panel
Mounting Type Panel Mount
Mounting FeatureBulkhead - Front Side Nut
Shell Material Polyamide (PA), Nylon, Glass Filled
Housing Material Nylon
Insert Material Polyamide (PA), Nylon, Glass Filled
Body Material Glass, Nylon
Operating Temperature-40°C~105°C
PackagingTray
Published 2010
Series Standard
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder Cup
Connector Type Receptacle, Male Pins
Number of Positions 10
Max Operating Temperature105°C
Min Operating Temperature -40°C
Color Black
Gender Male
Voltage - Rated 500V
Fastening TypeBayonet Lock
Contact Finish - Mating Gold
Current Rating (Amps) 2A
Orientation Keyed
Shielding Unshielded
Ingress ProtectionIP67 - Dust Tight, Waterproof
Current Rating2A
Shell Size - Insert B
Number of Contacts 10
Contact Gender Male
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Ratings IP67
In-Stock:987 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.692241$7.692241
10$7.256832$72.56832
100$6.846067$684.6067
500$6.458554$3229.277
1000$6.092976$6092.976

BU-10PMMS-LC7001 Product Details

BU-10PMMS-LC7001 Overview


The product comes in a package of Receptacle, Male Pins.Panel Mount is the type of mounting for the device.To package the product, a Tray case is used.The product is a member of the Standard Series.Use it when the temperature is below 105°C.Temperatures below -40°C are required for this device to operate.It is mounted by Panel.It operates at an operating temperature of -40°C~105°C.

BU-10PMMS-LC7001 Features


Standard series


BU-10PMMS-LC7001 Applications


There are a lot of Amphenol LTW
BU-10PMMS-LC7001 Circular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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