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HM2R10PA5100E9LF

HM2R10PA5100E9LF

HM2R10PA5100E9LF

Amphenol ICC (FCI)

Conn Hard Metric RCP 110 POS 2mm Press Fit RA Thru-Hole

SOT-23

HM2R10PA5100E9LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Contact MaterialBronze
Contact PlatingGold
Mount Through Hole
Mounting Type Board Edge, Through Hole, Right Angle
Housing Material Thermoplastic
Operating Temperature-55°C~125°C
PackagingTray
Published 2010
Series Millipacs®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit
Connector Type Receptacle, Female Sockets
Number of Positions 110
Max Operating Temperature125°C
Min Operating Temperature -55°C
Number of Rows 5
Voltage - Rated 500V
Current Rating (Amps) 1.5A
Pitch 0.079 2.00mm
Orientation Right Angle
Number of Positions Loaded All
Contact Finish Gold
Number of Contacts 110
Contact Resistance 20mOhm
Max Voltage Rating (AC) 500V
Connector Style A 22
Length 50mm
Contact Finish Thickness 39.4μin 1.00μm
RoHS StatusRoHS Compliant
In-Stock:1244 items

Pricing & Ordering

QuantityUnit PriceExt. Price
288$4.82510$1389.6288

About HM2R10PA5100E9LF

The HM2R10PA5100E9LF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Hard Metric RCP 110 POS 2mm Press Fit RA Thru-Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HM2R10PA5100E9LF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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