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HLEM3R-1RLF

HLEM3R-1RLF

HLEM3R-1RLF

Amphenol ICC (FCI)

CONN FFC TOP 3POS 1.25MM R/A

SOT-23

HLEM3R-1RLF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialPhosphor Bronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-55°C~85°C
PackagingTray
Series HLEM R
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Kinked Pin
ECCN Code EAR99
Connector Type FFC/FPC CONNECTOR
Number of Positions 3
Number of Rows 1
Voltage - Rated 200V
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.049 1.25mm
Total Number of Contacts 3
Current Rating1A
Contact Finish Tin
Contact Gender FEMALE
UL Flammability Code 94V-0
Housing Color Black
Mating Cycles30
Flat Flex Type FFC, FPC
Connector/Contact Type Contacts, Top
Cable End Type Straight
Contact Finish Thickness 39.4μin 1.00μm
Height Above Board 0.197 5.00mm
FFC, FCB Thickness 0.30mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:2731 items

About HLEM3R-1RLF

The HLEM3R-1RLF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN FFC TOP 3POS 1.25MM R/A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HLEM3R-1RLF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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